Frustrated with messy BGA reballing that damages delicate chips? Imagine achieving skilled-grade soldering with accuracy and ease. Our BGA Reballing Kit HT-90 solves this with an aluminum alloy diagonal template that handles chips from 9mm to 43mm. It includes 10 steel meshes and adjustable features for neat tin bead control, ideal for repairing laptops, CPUs, and phones. Get consistent results every time and elevate your DIY electronics projects.
Item Type: BGA Reballing Rework Station
Product Material: Aluminum alloy + stainless steel
Set Specifications: HT-90 tin planting station, 10Pcs 90 steel mesh
Application Chip: Smallest Clipable Chip: Approx. 9 x 9mm / 0.4 x 0.4in
Maximum Clip: Approx. 43 x 43mm / 1.7 x 1.7in
Application: BGA manual soldering for plant tin rework of notebook computer CPU mobile phone digital products.
Package List:
1 x BGA Reballing Rework Station (Composed of 2 Accessories)
1 x Hex Wrench
10 x Universal Steel Mesh