UPSIREN's thermal pad is a game - changer in heat management. It incorporates high - performance filler and advanced polymer technology, ensuring superior thermal conductivity. With a 0.25mm thickness, its upgraded texture prevents splitting, having passed over 1000 tests. Available in both pad and paste forms, it offers easy installation. Phase - changing at 45°C, it efficiently transfers heat, staying solid at room temp and softening upon heating for long - term reliability. Perfect for cooling various electronics.