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Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B in Kuwait

Electronic Potting Compound, Electronic Sealing Compound Transparent Waterproof Becomes Hard After Curing for Electrical Insulation, Potting, Encapsulating, Circuit Board, 300g A+B

KWD 7

Brand
WANJAO
Category
Lubricants
Weight
18 g
ColorClear
1 +

Special Features

  • Insulation and Waterproofing: The electrical encapsulant has excellent insulation and waterproofing properties, effectively preventing the ingress of water , and protecting electronic.

Description

How to use:
1. Weighing
Use an electronic scale to accurately weigh the AB materials at a weight ratio of 2:1 (stir the A glue thoroughly before weighing) to ensure that the resin on the container wall and bottom is fully stirred.
2. Proportion
Mix the weighed A and B materials and stir them evenly. When stirring manually, ensure that the resin on the container wall and bottom is fully dispersed.
3. Pouring
Pouring the mixed A and B materials into the objects that need to be poured, and cure at room temperature or medium room temperature wait 20-30 minutes.It usually takes longer to completely cure. It is recommended to wait at least 2 hours after debonding before contacting with water or performing operations such as polishing to ensure that the solvent is completely evaporated and the glue layer is stable.
4. Curing process
It can gradually cure into an elastic solid at room temperature

Note:
Mixing ratio: Strictly follow the instructions (such as A:B=2:1), otherwise it may affect the curing effect.

When potting, please apply the adhesive evenly to ensure it completely covers the parts to be protected to avoid bubbles or gaps.

Curing conditions: Room temperature curing may take more than 24 hours.

Surface treatment: Please clean the potting area before use to achieve the best bonding effect.

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