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MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts in Kuwait

MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts

KWD 26.500
– 1 +

Special Features

  • Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low Voltage
  • Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates
  • None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components
  • Opaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium Setting
  • Low Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190°F (90°C) Operating Temperature

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