Benefits: High strengthExcellent mechanical, electrical properties Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical application: microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing. 2 hours: @ 125C 1 hour: @ 150C 1/2 hours: @ 175C Viscosity @ 25 C cps: 200,000 Shelf life: 6 Months Density: 3.6 Thermal Conductivity, btu/hr/ft2/F/in: 16.1 Coefficient of Thermal Expansion: 60x 10^-6 (in/in) C Operating Temperature: -55C to +175CIntermit. to 325 Volume Resistivity ohm. cm: