MAX MCR -Electronic Grade Potting Compound 4 Circuit Board, PCB Encapsulating, Embedding, Opaque Black Masking, Thin, Injectable, 1.5 Inch Thick Casting, Low Exotherm, Medium Set Time, 1.5 Gallon Kit
Special Features
Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate AC/DC High And Low Voltage
Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates
None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components
Opaque Black For Permanent Masking, Room Temperature Curing, 2:1 Mix Ratio, Medium Setting
Cures Very Rigid, Up To 190°F (90°C) Operating Temperature
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