POLISH & SEALING PAD. Extra-fine finish sponge for economically and evenly applying sealing products such as the 1K Nano or Lack-Polish grün P1.01. The short height of 23mm creates low torsion forces, excellent handling, and the highest level of stability. The optimized reticulation (open cellular structure) and cell count contribute to excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours more easily. The colorful non-woven material, suitable for polishing, ensures process safety. COMPRESSION HARDNESS: 4 ABRASIVENESS: 2 Notice. This product information can advise you only without obligation. Liability on the part of Koch-Chemie cannot be derived. Please check whether the product is suitable for your application.