*Excellent Insulation In high-performance integrated circuit devices, insulation is of utmost importance. LMTG100 utilizes a polymer to encapsulate the liquid metal in a capsule form. The polymer coating layer offers outstanding insulation, effectively preventing short circuits between circuits, ensuring the normal operation of the device, and enhancing the stability and reliability of the system.
*High Thermal Conductivity The liquid metal core within has an extremely high thermal conductivity coefficient, far surpassing that of traditional thermal grease materials. It can rapidly and efficiently conduct away the large amount of heat generated by high-performance integrated circuit devices like CPUS/GPUS, significantly improving the heat dissipation efficiency and helping to maintain the device at a lower operating temperature, thereby extending its performance and service life.
*Ultra-Low Thermal Resistance Thermal resistance is a crucial indicator for evaluating the performance of heat dissipation materials. The ultra-low thermal resistance characteristic of LMTG100 enables it to establish a more efficient heat conduction path between the heat source and the heat sink, reducing heat transfer losses. This allows heat to be dissipated from the device to the surrounding environment more quickly, contributing to the improvement of the overall system's stability and reliability.
*Superior Interface Wetting The excellent interface wetting property of LMTG100 enables it to better fill the tiny gaps between heat dissipation interfaces, ensuring full contact between the heat dissipation material, the device surface, and the heat sink. This maximizes its heat dissipation performance and minimizes local overheating caused by poor contact.
*Convenient and User-Friendly Application In comparison to conventional thermal dissipation substances, LMTG100 presents a more straightforward and efficient application process. It exhibits excellent fluidity and coating properties, facilitating effortless application onto the surface of electronic components. During the coating procedure, issues such as excessive flowing or dripping are effectively precluded, thereby guaranteeing a uniform distribution of the thermal material. This homogeneity in turn maximizes the heat dissipation performance, enabling the attainment of an optimal thermal management outcome.
Note: LMTG100 is almost non-corrosive under normal conditions, but it is not recommended to directly contact with aluminum-based components. If contact is necessary, it is recommended to conduct protective treatment on the contact surfaces first. LMTG100 has good electrical insulation performance. However, if LMTG100 accidentally falls onto a component, do not directly wipe it vigorously. It is recommended to gently pick it up or use a cotton swab dipped in anhydrous ethanol to gently wipe it off to remove LMTG100.
Description
Note: LMTG100 is almost non-corrosive under normal conditions, but it is not recommended to directly contact with aluminum-based components. If contact is necessary, it is recommended to conduct protective treatment on the contact surfaces first. LMTG100 has good electrical insulation performance. However, if LMTG100 accidentally falls onto a component, do not directly wipe it vigorously. It is recommended to gently pick it up or use a cotton swab dipped in anhydrous ethanol to gently wipe it off to remove LMTG100.
12.8w/mk Thermal Putty for VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty High Performance (10g)
KWD 4.500
Ultra 16.8w/mk Thermal Putty for VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty (20g)
KWD 10.500
UTP-8 14.8w/mk Thermal Putty for VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty High Performance (10, Grams)
KWD 5.500
92mm CASE Cooling Fan, Computer Case Fan, 4pin PWM SFF PC Fan, 25mm Thick, 1200/2500RPM Speed, 40/65CFM, Silent CPU Cooling Fan (1PC, Black, 9CM)
KWD 3.500
