Technology Thermal Paste 8.0 W/mK 55ml, TG-N8000 Non-Silicone Putty, Thermal Gel Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components
THERMAL CONDUCTIVITY-quality thermal paste with 8.0 walt/ thermal conductivity which can meets the requirements of high-end anti-heat and belongs to the high-end flagship thermal putty.
EXCELLENT PERFORMANCE- Temperature: -45-125° . Upgraded thermal paste greatly improve the heat transfer between electronic components and effectively reduce the temperature within seconds.
NON SILICON OIL-without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components.
VERSATILE APPLICATIONS-5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
100% SATISFACTION - Feel free to contact us if you have any question or mass order demand, we care customers and make sure 100% satisfaction customer service reply within 24 hours.