Specification:
Thermal Conductivity: 12.5±10%W/mK
Thickness: 1.0 mm
Color: Green
Dielectric Breakdown Voltage: >10 KV/mm
Density: 3.3±5%g/cm³
Operating Temperature: -50~150°C
Volume Resistivity: 1x10^13
Elongation: 40%
Hardness: Shore OO 55
*For thicknesses of less than 1.0mm hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during application

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.
Features:
Great thermal conductivity
Difficult to be deformed
Easy to assemble
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Operating Manual:

1.Tearing off the release paper.
2.Gently attach the thermally conductive silicon pad to the heat source.
3.Remove the protective film
4.Apply components onto the exposed part and apply pressure at fixture.

Storage:

Store in a cool, dry place away from direct sunlight.