The gold finger adopts the immersion gold process with a gold thickness of up to 3U, which enhances the plug-in service life and good electrical performance of the product.
High-speed PCIE 8X and 16X boards are supported, for 1U 2U server chassis expansion, convenient and fast, no drivers required.
Using All-copper high-density wiring, the line has the flexibility of bending and bending, which does not affect the transmission efficiency and use function of the line.NOT support hot swaping.