THERMAL CONDUCTIVITY-quality thermal silica gel material with 5.0 walt/ thermal conductivity which can meets the requirements of middle and low-end anti-heat and belongs to the middle-end flagship thermal conductive silicon film.
EXCELLENT PERFORMANCE- Temperature: -45-180° . Upgraded thermal pad materials greatly improve the heat transfer between electronic components and effectively reduce the temperature within seconds.
VERSATILE APPLICATIONS-5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
SAFE HANDLING-It contains no metal particles, is electrically insulating and non-capacitive. Handling is therefore safe, as contact with electrical parts will not cause damage
100% SATISFACTION - Feel free to contact us if you have any question or mass order demand, we care customers and make sure 100% satisfaction customer service reply within 24 hours.
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