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Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU in Kuwait Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU in Kuwait Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU in Kuwait Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU in Kuwait Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU in Kuwait

Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

KWD 113
Brand
T-Global
Category
Fans & Cooling
Weight
0.5 kg
– 1 +

Special Features

  • EXCELLENT THERMAL CONDUCTIVITY-Thermal Paste conductivity 9.0 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
  • HIGH DURABILITY-The non-silicone thermal Heatsinks paste Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -40℃-200℃ environment. High heat dissipation performance, high-cost performance. It will not compromise over time.
  • EASY TO USE-Thermal paste has ideal consistency and is very easy to use even for beginners;it is also not electrically conductive : there is no risk of short-circuits and safe to use with all types of heatsinks
  • SAFETY APPLICATION-It has low thermal resistance and suitable for CPU radiator or chip. and high conductivity can achieve excellent heat transfer. Suitable for CPU, VGA, chipset, and other PC components.
  • 100% SATISFACTION - Feel free to contact us if you have any question or mass order demand, we care customers and make sure 100% satisfaction customer service reply within 24 hours.

Description

Specification:
Thermal Conductivity:9.0±10%W/mK
Viscosity: 300±100Pa·s
Density: 2.85±5%g/cm³
Operating Temperature: -40~200°C
Volume Resistivity: 1x10^13 Ohm-m

Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle,Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.
Features:
Silicone-type spacer with great long term reliability
Lower thermal resistance than thermal pads
Physical property between liquid and solid state
Elimination of different gap between heat source and the heatsink

Storage:

Store in a cool, dry place away from direct sunlight.

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