Thermal Pad, 120x120x2.0mm, 12.8 W/m.K Thermal Compound Pad, Thermal Conductivity Gap Filler, Heatsink Cooling Pad All Coolers, CPU, GPU, IC Processor, 3D Printer, Raspberry Pi
[UNIQUE PERFORMANCE]: high thermal conductivity (12.8 W/m.K), balance thermal resistance and viscosity can keep mushy for a long time, which enhance wettability and improve the thermal conductivity of contact surface, ensure heat dissipated quickly & efficiently.
[SAFE APPLICATION]: non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges and corrosion damage to the radiator bottom.
[AVAILABLE CHOICES]: dimensions of 120mm x 20mm, 90mm x 50mm, 120mm x 120mm, 20mm x 20mm, 30mm x 30mm, thicknesses of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm.
[EASY TO USE]: widely used for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memorys, SMD components, IC Processor, Heatsink, 3D Printer, Raspberry Pi and DIY heat dissipation devices, suitable for beginners.
[WHAT YOU GET]: 1 pack size of 120mm x 120mm, thicknesses of 2.0mm silicon thermal pads, scraper, clean package. 100% refund / replacement services if quality issue or delivery damanged.
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