Specification:

Thermal Conductivity: 3.0±10%W/mK
Thickness: 3.5mm
Color: Yellow
Dielectric Breakdown Voltage: 18 KV/mm
Density: 2.3±5%g/cm³
Operating temperature: -50~180°C
Volume Resistivity: 8x10^12
Hardness: Shore OO 35±10
*For thicknesses of less than 1.0mm hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during application

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.

Features:

Good Thermal Conductivity Ability - Using the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. Outstanding performance - Low thermal resistance & Electrical insulation Safe and easy to use - You can choose a suitable thickness of thermal pad according to the gap between the heating source and the heat sink. It can be cut to size and easy to install, replacing the traditional thermal paste. Application - Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc.

Operating Manual:

1.Tearing off the release paper.
2.Gently attach the thermally conductive silicon pad to the heat source.
3.Remove the protective film.
4.Apply components onto the exposed part and apply pressure at fixture.

Storage:

Store in a cool, dry place away from direct sunlight.