High quality material: This mobile phone mainboard repair fly wire is made of high-quality copper material, with a conductive surface that is waterproof, sealed, strong adhesion, high tensile strength, aging resistance, solvent resistance, and softening resistance.
High flexibility: The diameter of this repair flying wire is approximately 0.02 millimeters. The newly upgraded version of ultra-fine wire diameter has stretching function, which is truly bare copper. More importantly, the jumper is very small, easy to straighten, not easy to break, mainly straight and not bent, and can also be pulled to a smaller size.
Precision connection: The fingerprint jumper of the mobile phone motherboard adopts a ultra-fine diameter design, precise connection, avoiding short circuits between 0.1mm solder joints. It is insulated, easy to tin, thin enough and straight enough to fill special points with flying wires.
Scope of application: Ultra fine jumper is widely used in fingerprint repair/PCB BGA solder joints or other small solder joints of mobile phones, screensaver, tablets, laptops, cameras, lenses, batteries, LCD panel displays, LCD touch screens and other equipment.
Product information: This product includes a flying wire (120m) * 1, a storage box * 1, and a wire diameter of: Φ 0.02mm, line length: 120m, quality and safety, you can use it with confidence.