1. [ALUMINUM ALLOY CONSTRUCTION] Crafted from oxidation- aluminum alloy for durability and rapid heat dissipation
2. [PASSIVE COOLING DESIGN] Operates silently while maintaining stable performance of your development board
3. [THOUGHTFUL LAYOUT] Ensures WiFi and BT signals remain unaffected for a stable connection
4. [ACCURATE ENGINEERING] Specially designed for Orange Pi 3 for seamless integration
5. [FULL GUARD KIT] Includes bottom plate, top plate, heat conduction sheets, and screws for easy assembly

Spec:
Item Type: Development Board Case
Product Material: Aluminum Alloy
Size: Approx. 55 x 50 x 14mm / 2.2 x 2 x 0.6in
Applicable Model: For Orange Pi 3

How to Use:
Direct installation and use

packing list:
1 x Bottom Plate
1 x Top Plate
1 x Screw Pack
2 x Heat Conduction Sheets