[REINFORCED DESIGN] Equipped with retaining pins, the pads are securely attached and will not fall off during use. This s a reliable connection, any potential issues during the repair process.
[FLATNESS FOR OPTIMAL PERFORMANCE] The excellent flatness of the pad minimizes the risk of virtual welding caused by uneven s, making it perfect for intricate electronic repairs and maintaining the integrity of your devices.
[EASY TO USE] Simply peel off the protective layer to reveal the ; it's ready for immediate application. This user-friendly design means you can focus on your repairs without any hassle.
[SIZING REMINDER] Each pad measures approximately 8x5.8 cm (2x2.3 inches). Please to check your sizing requirements before purchase.
Description
Product Description:
Made of material,
Pad Rework-Mobile Phone IC Spot Soldering-Touch for BGA-PCB Pad.
Flying wire supplementary spot welding sheet mobile phone maintenance flying wire pasting pad drop point traceless repair without circle.
Just peel off the protective layer, it can be used and repaired.
The for pads are reinforced with retaining pins and will never fall off.
Improve maintenance efficiency, achieve the pad effect& seamless.
The flatness is good, which can effectively prevent the virtual welding caused by unevenness.
Material: Copper wire+ PC plastic plate
Size: approx. 4.8x5.8 cm/2x2.3 inches
1 Pc equals or exceeds 100 solder points of different shapes.