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Thermal Pad 15.8 W/mK, 100x100x2mm, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for PC Laptop PS4/PS5/CPU/GPU/Computer in Kuwait

Thermal Pad 15.8 W/mK, 100x100x2mm, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for PC Laptop PS4/PS5/CPU/GPU/Computer 100x100x2mm

KWD 6

Brand
WithFlying
Category
Fans & Cooling
Size100x100x2mm
1 +

Special Features

  • 【Upgrade thermal pads】Upgraded thermal silica gel material with 15.8 W/mK thermal conductivity, our thermal pad greatly improves the heat transfer between the electronic elements and Let the GPU cool down quickly.
  • 【Product Usage】Our thermal pads are suitable for: laptops, graphics cards, PS4,PS5, GPU, CPU, DRAM memory modules, SSD, Communication equipment, Solid state hard disk , Car control equipment, Gaming equipment.
  • 【Product Feature】High temperature performance in -40 ℃——205 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn't result in damage of any sort.
  • 【Product size】 Size 100x100x2mm. Our thermal pad also have 0.5mm, 1mm, 1.5mm, 2.5mm, 3mm thick. Please choose thickness according to the actual situation. The thicker the cooling effect, the better.
  • 【Easy convenient to use】The thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.

Description

Thermal Pad 15.8 W/mK, Non-Conductive Heat Resistance & High-Temperature Resistance Key Features: High performance cooling solution: high thermal conductivity (15.8 W/mK) to ensure fast and efficient heat dissipation Unique properties: balance thermal resistance and viscosity, and improve thermal conductivity of contact surfaces Safe application: non-volatile, flame retardant, metal-free, non-conductive, eliminating the risk of short circuits and discharges Easy to install: easily cut with different sizes to align with practical real cooling scenario.

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