【Add the Missing Drying Function to Your AMS】Designed specifically for the Bambu Lab AMS (1st Generation), The SUNLU AMS Heater transforms your AMS from a mere filament storage unit into an active drying chamber during printing. Eliminate the need for pre-drying and drastically reduce issues like layer separation, bubbles, and stringing caused by moisture. Simply replace the AMS top cover to upgrade your AMS into an active drying chamber. Note: This product includes only the AMS Heater; the AMS main unit is not included.
【Rapid & Uniform Heating, Up to 70°C】Equipped with high-efficiency PTC heating elements, it reaches 70°C in just 20 minutes. The dual-airflow circulation system ensures even heat distribution throughout the chamber, preventing localized overheating or warping of filament spools. Whether printing with PLA, PETG, ABS, TPU, PA, or nylon, it maintains optimal drying conditions for stable, extended print sessions.
【Smart Humidity Monitoring & Safety Protection】Built-in high-precision humidity sensor displays chamber humidity in real time. In Standard Mode, it defaults to 6 hours of heating with continuous monitoring, automatically activating when humidity ≥50% and stopping when ≤20%. In rH Mode, customize humidity range (25%–50% rH) and duration. Features over-temperature protection, fan anomaly detection, and automatic power-off for guaranteed safety.
【Simple Installation, Perfect Fit for AMS】Compatible with Bambu AMS's existing sealing strips and moisture-proof structure. No additional accessories required—installation completes in three steps within 2 minutes. Features a transparent top window for real-time filament monitoring. Supports simultaneous drying and feeding of multiple filament rolls inside AMS, compatible with multi-color stacked printing (up to 16 colors).
【Reduce Failure Rates, Boost Print Success】Moisture-prone filaments often cause nozzle bursts, weak layer adhesion, or rough surfaces. The AMS Heater effectively prevents these humidity-related issues, delivering smoother prints with tighter layer bonding to minimize material waste. It serves as both a functional enhancement for your AMS and a critical upgrade for improving print success rates.