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Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board in Kuwait

Orange Pi Zero 3 Model Case, Aluminum Alloy Case for Orange Pi Zero 3, Passive Cooling Cutouts Development Board Enclosure Case, Heatsink Box Cover Protection Shell Metal Cover Development Board

KWD 7
Brand
Elictech
Category
Computer cases
– 1 +

Special Features

  • Specificity: The board housing is designed specifically for the Orange Pi Zero 3 and has a precise opening that corresponds to the Orange Pi Zero 3 opening, ensuring unobstructed access
  • Passive Cooling Technology: This development board enclosure cooling chassis utilizes passive cooling technology to effectively improve the efficiency of the motherboard and maintain better performance
  • Fast Thermal Conduction: This board is designed to quickly conduct heat and strengthen the tight connection between the enclosure and the motherboard
  • Stability: The heat sink of this board's enclosure can help reduce the temperature of the motherboard and maintain stable performance
  • Aluminum Alloy: The housing of this development board is made of aluminum alloy, and the sturdy housing effectively protects the motherboard from external shocks and damage

Description

ProductSpecifications: Orange Pie 3Aluminum Alloy Shell
Product Type: Electronic Module
Applicable Model: Orange Pi Zero 3
Product Size: 55 x 50 x 14 mm/2.2 x 2.0 x 0.6 inch
ProductWeight: 40 g / 0.09 pounds
Material: Aluminum Alloy
Communication Interface: ADC Interface
Power Supply Voltage: 1.8-5.5V
Supply Current: 100nA
Applications: Metal Protective Case for Heat Dissipation of Development Board

Packing List: 1 x Top Cover, 1 x Bottom Plate, 1 x Screw Set

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