Yosoo Heat Dissipation Case, Aluminium Alloy Case for Orange Pi 3, Passive Cooling Development Board Enclosure Case with Precise Cutouts
Special Features
- [Thermal Adhesive Design] Ensures fast heat conduction and a secure connection between the case and motherboard.
- [Efficient Cooling] Cooling heatsink helps reduce motherboard temperature for stable performance operation.
- [Durable Aluminum Shell] Made of strong aluminum alloy, providing effective defense against external shocks and damages.
- [Precise Cutouts] Designed specifically for orange pi 3 to ensure unobstructed operation with precise cut outs.
- [Passive Cooling Technology] Utilizes passive cooling technology to enhance motherboard efficiency and performance.
Description
Spec:
Item Type: Aluminium Alloy Case for Orange Pi 3
Material: Aluminum Alloy
Model: for Orange Pi 3
Package List:
1 x Top Cover
1 x Base Plate
1 x Screw Kit
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