darkFlash DS900 Air ATX Mid-Tower PC Gaming Case, High Airflow, 270°Full-View Tempered Glass, Tool-Free Clamshell Side Panel, Supports RTX 5090 up to 425mm,360mm Top Radiator, USB-C, Black
270° Full-View Tempered Glass (Front & Side) – Showcase-grade full-view tempered glass panels on the front and side provide an unobstructed view of your build and RGB lighting for a true display-quality gaming PC.
Flexible High-Airflow Layout – Optimized cooling support with up to 3×120mm fans at the bottom, 360mm radiator support at the top, 1×120mm rear exhaust and space for 2×120mm fans on the right side — ideal for air-cooled or AIO liquid-cooling configurations.
Separate Bottom PSU Chamber – Bottom-mounted PSU chamber isolates power and cables from the main hardware bay for cleaner cable management, improved airflow, and straightforward routing during builds.
Tool-Free Clamshell Side Panel & Top-Right I/O – Quick-release clamshell side panel allows fast, screwless access for upgrades and maintenance; top-right I/O includes USB-C plus USB 3.0/audio for convenient front access.
Wide Compatibility & Builder-Friendly Design – ATX/mATX/ITX compatible with 7 PCIe slots, supports GPUs up to 425mm and CPU coolers to 170mm. Plenty of drive and routing options make the DS900 Air a versatile ATX mid-tower for high-performance gaming rigs.
Description
The darkFlash DS900 Air ATX mid-tower marries panoramic display with serious cooling capability for high-performance gaming and creator rigs. Featuring 270° full-view tempered glass on the front and side and a tool-free clamshell side panel for fast access, the DS900 Air supports flexible cooling layouts—top 360mm radiator, bottom 3×120mm, right-side 2×120mm, and rear 1×120mm—so you can build air-cooled or AIO/custom-loop systems. A separate bottom PSU chamber keeps cables hidden and improves airflow, while the top-right I/O includes USB-C for quick connectivity. Built to accept flagship hardware, the chassis fits GPUs up to 425mm and CPU coolers up to 170mm, delivering both showpiece presentation and thermal performance.