Key Parameters​​

Core Chip: MCP2551 (Microchip , ISO 11898 Compliant)

Supply Voltage: 4.5V-5.5V DC (5V Logic Compatible, Supports 12V/24V Bus Settings)

Communication Rate: Up to 1 Mbps (Supports 112 Bus Nodes)

Protection: Short-Circuit (±45V Tolerance), Thermal Shutdown (>150°C), Undervoltage Lockout (UVLO

Operating Temperature: -40°C to +85°C (Reliable)

Interface: 8-Pin Terminal Block (2.54mm Pitch)
​​Pin Functions​​

VDD (Pin 8): Power Input (4.5V-5.5V). Use 10μF Electrolytic + 100nF Ceramic Capacitors.

GND (Pin 4): Power Ground. Star Point Grounding Recommended.

TXD (Pin 1): Data Input (Microcontroller TX). Series 220Ω Resistor for Ringing Suppression.

RXD (Pin 2): Data Output (Microcontroller RX). Parallel 10kΩ Pull-Up to VDD.

Rs (Pin 3): Mode Control: Floating = High-Speed, 47kΩ to GND = Slope Control (EMI Reduction), GND = Low-Power Standby.

CANH (Pin 7): Bus High-Level Line. Twist with CANL (Pitch ≤20mm), Terminate with 120Ω Resistor.

CANL (Pin 6): Bus Low-Level Line. Length Deviation from CANH ≤2mm.

​​FAQ​​

1.
​​Communication Failure?​​

Check Terminal Resistors (120Ω at Both Ends).

Verify Baud Rate Consistency Across Nodes.

Confirm CANH/CANL Wiring Polarity.

2.
​​Module Overheating?​​

Check for Bus Short-Circuit (CANH-CANL Resistance >60Ω).

Reduce Node Count for High Baud Rates (>20 Nodes).

Switch to Slope Control Mode (Rs=47kΩ) to Reduce EMI/Heat.

3.
​​3.3V Microcontroller Compatibility?​​

Direct Connection Supported (TXD High-Level Threshold: 1.8V).

Add Series 1kΩ Resistor to RXD for MCU Protection.