[ Material] These bga reballing stencils are crafted from premium stainless steel ensuring durability and long lasting performance. the thickness of the steel mesh provides optimal strength and for reballing results every time. designed to withstand high temperatures without deformation these stencils are a reliable tool for professional repairs.
[Heat Design] Engineered to endure direct heat from hot air machines these stencils maintain their shape and integrity even under intense temperatures. the heat properties make them ideal for repeated use in demanding rework environments ensuring consistent performance and reliability for all your bga reballing needs.
[Versatile Application] Specially designed for repairing laptop desktop communication main board north south bridge and graphics card bga these stencils are a must have for any electronics repair toolkit. their universal compatibility makes them suitable for a wide range of bga chip rework applications providing exceptional value and convenience.
[User Friendly Markings] Each stencil features clear specifications marked on the surface allowing for quick and easy identification. this thoughtful design eliminates guesswork and saves valuable time during repairs ensuring you can select the right stencil for the job without any hassle.
[Comprehensive Kit] This kit includes 130 pieces of bga stencils in 6 different sizes catering to a wide range of bga chip repairs. with 3 pieces for 0.35mm 2 pieces for 0.4mm 7 pieces for 0.45mm 35 pieces for 0.5mm 60 pieces for 0.6mm and 23 pieces for 0.76mm solder balls you have everything needed to tackle various reballing projects with ease and .