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BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products in Kuwait

BGA Reballing Station Diagonal Universal Stencil Solder Aluminum Rework Kit HT 90 90x90 for Laptop CPU Mobile Phone Digital Products

KWD 17.500

Brand
ZephyVita
Weight
372 g
1 +

Special Features

  • [PREMIUM ALUMINUM ALLOY MATERIAL] This reballing station features a high-quality aluminum alloy structure that is light, durable, and wear-.
  • [UNIVERSAL DIAGONAL BALL PLANTING FIXTURE] The BGA station is designed with a universal diagonal ball planting fixture suitable for 9mm to 43mm BGA chip ball planting.
  • [EFFICIENT TIN BEAD REMOVAL] Adjust the chip size knob and diversion groove to easily pour out excess tin beads, ensuring precise reballing results.
  • [VERSATILE APPLICATION] Ideal for plant tin rework of laptop CPU and mobile phone digital products, providing convenience for BGA manual welding.
  • [EASY TO USE] The BGA reballing station is user-friendly, making it a practical tool for professional rework tasks in various electronic devices.

Description

[PREMIUM ALUMINUM ALLOY MATERIAL] This reballing station features a high-quality aluminum alloy structure that is light, durable, and wear-.
[UNIVERSAL DIAGONAL BALL PLANTING FIXTURE] The BGA station is designed with a universal diagonal ball planting fixture suitable for 9mm to 43mm BGA chip ball planting.
[EFFICIENT TIN BEAD REMOVAL] Adjust the chip size knob and diversion groove to easily pour out excess tin beads, ensuring precise reballing results.
[VERSATILE APPLICATION] Ideal for plant tin rework of laptop CPU and mobile phone digital products, providing convenience for BGA manual welding.
[EASY TO USE] The BGA reballing station is user-friendly, making it a practical tool for professional rework tasks in various electronic devices.

Spec:
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.

Package List:
1 x BGA Reballing Station
1 x Hex Wrench

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