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BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H in Kuwait

BGA Reballing Station Universal Aluminum Alloy Stencil Kit with Steel Mesh for Mobile Phone Chip Laptop CPU Repair HT80H

KWD 16.500
Brand
Cloimei
Weight
378 g
– 1 +

Special Features

  • [HIGH-QUALITY ALUMINUM ALLOY BUILD] Designed with premium aluminum alloy, this BGA reballing station offers exceptional durability while remaining lightweight. The electroplated surface resists oxidation and wear, ensuring long-term reliability for professional technicians.
  • [VERSATILE CHIP COMPATIBILITY] for repairing various BGA chips found in smartphones, laptops, and digital devices. The universal design accommodates both rectangular and square chips from 9x9mm to 43x43mm, making it an essential tool for electronics repair shops.
  • [PRECISION STEEL MESH STENCIL] Features a high-precision steel mesh that guarantees accurate ball placement during reballing. The included five removable accessories and hex wrench provide complete functionality for all your BGA rework requirements.
  • [EFFICIENT WORKFLOW SOLUTION] Streamline your repair process with this intuitive reballing station. The sturdy aluminum frame maintains stability during operation, while the universal design reduces setup time between different chip sizes and types.
  • [PROFESSIONAL-GRADE PERFORMANCE] Engineered for electronics repair specialists, this station delivers professional results with every use. The HT80H model's combination of durability, precision, and versatility makes it ideal for demanding workshop environments.

Description

Item Type: For BGA Reballing Station
Product Model: HT-80H
Material: Aluminum alloy
Uses: For BGA manual welding for cell phone, chip, laptop CPU, cell phone digital products plant tin rework.
Features: For BGA universal reballing station with all aluminum alloy electroplating, not easy to oxidize, and more wear-.
Application: Suitable for all for BGA chip ball planting, regardless of rectangular or square chip.
Suitable for BGA chip reballing of approx. 9 x 9mm / 0.4 x 0.4in to approx. 43 x 43mm / 1.7 x 1.7in chips.

Package List：
1 x For BGA Reballing Station(5pcs removable accessories)
1 x Hex Wrench

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