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BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H in Kuwait

BGA Reballing Station Universal Aluminum Alloy Steel Mesh Stencil Kit for Laptop CPU Phone Chip Repair Professional Soldering Tool HT80H

KWD 17
Brand
Adfaga
Weight
378 g
– 1 +

Special Features

  • [PREMIUM ALUMINUM CONSTRUCTION] Built with high-grade aluminum alloy, our BGA reballing station offers superior durability while remaining lightweight. The electroplated finish prevents oxidation and ensures years of reliable performance even with frequent use.
  • [UNIVERSAL CHIP COMPATIBILITY] for repairing various electronics including smartphones, tablets, laptops and gaming consoles. Handles both rectangular and square BGA chips from 9mm to 43mm with precision and ease.
  • [PRECISION STEEL MESH DESIGN] Features a high-quality steel mesh stencil that ensures solder ball alignment during reballing. The fixed mesh provides stability and accuracy for professional-grade results every time.
  • [COMPREHENSIVE REPAIR KIT] Includes 5 essential removable accessories plus a hex wrench for complete BGA rework capability. Everything you need for efficient chip-level repairs in one professional package.
  • [ERGONOMIC WORKSTATION] Designed for comfortable, prolonged use with intuitive operation. The sturdy yet lightweight construction makes it ideal for repair shops, technicians, and electronics enthusiasts alike.

Description

Item Type: For BGA Reballing Station
Product Model: HT-80H
Material: Aluminum alloy
Uses: For BGA manual welding for cell phone, chip, laptop CPU, cell phone digital products plant tin rework.
Features: For BGA universal reballing station with all aluminum alloy electroplating, not easy to oxidize, and more wear-.
Application: Suitable for all for BGA chip ball planting, regardless of rectangular or square chip.
Suitable for BGA chip reballing of approx. 9 x 9mm / 0.4 x 0.4in to approx. 43 x 43mm / 1.7 x 1.7in chips.

Package List：
1 x For BGA Reballing Station(5pcs removable accessories)
1 x Hex Wrench

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