BGA Reballing Stencil for A60 to A90, Stainless Steel Phone CPU Rework Template, 0.12mm Spacing, Soldering Stations
Special Features
- Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very for long term using.
- for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
- Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
- Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
- Fitting: Allows for wide application on for SDM450, 660, MT6762 CPU as well as for A60‑A90 series, A10S, A605F, A705F and more.
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