[HIGH PERFORMANCE THERMAL CONDUCTIVITY] This thermal conductive glue features exceptional heat dissipation properties with a thermal conductivity of over 0.671W/M.K. The silicone grease material ensures efficient heat transfer from chipsets to heatsinks while maintaining stable performance across a wide temperature range from -60°C to 300°C. for demanding electronics that require reliable thermal management.
[SUPERIOR ADHESION & DURABILITY] Engineered with 1.5MPA viscosity for strong, lasting bonding between components. Our thermal paste creates a permanent yet flexible connection that withstands vibration and mechanical stress. The adhesive maintains its properties over time, ensuring consistent heat transfer performance throughout your device's lifespan.
[PREMIUM INSULATION PROPERTIES] The silicone grease formulation provides excellent electrical insulation while effectively conducting heat. This dual functionality prevents short circuits and protects sensitive electronic components from , water, , and oxidation damage. An ideal solution for high-performance computing and power electronics applications.
[VERSATILE APPLICATION RANGE] Specially formulated for use with MOSFETs, LED arrays, graphics cards, chipsets, and various heat dissipation components. Suitable for both professional and DIY applications in electronics, appliances, and industrial equipment. Comes in convenient 5g portions for precise application control.
[USER-FRIENDLY DESIGN] Each package contains 10 individual 5g units of thermal conductive glue for multiple uses. The compact size makes storage and transportation effortless. The paste's optimal viscosity ensures easy application without dripping or mess, working ly with heatsinks that lack fixed clips for hassle- installation.
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