Careful use of TG Scraper: Avoid damaging smaller electronic components on CPU package or dies
To remove Indium-Lot from CPU dies, gently scrape surface with TG Scraper, then use liquid metal to remove remaining lot
Description
The TG Scraper, crafted from acrylic glass, is a uniquely designed scraper with a narrow tip, ideal for removing silicone adhesive from the package (PCB) of a decapped processor or residual indium solder from CPU dies. Its ergonomic shape ensures a firm and secure grip.