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Technology Thermal Paste 8.0 W/mK 30ml, TG-N8000 Non-Silicone Putty, Thermal Gel Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components
KWD 36.500
Technology Thermal Pad 12.5 W/mK, 155X155X1.0mm, TG-A1250 High Thermal Conductivity, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Electrical Insulation
KWD 25
Technology IG-A6250 High Performance Thermal Pad-60-80-1.5 - Thermal Conductivity 5.0 W/mK - for IC SSD CPU GPU Heat Sink LED Chipset Cooling
KWD 8
Technology Thermal Paste 9.0 W/mK 1kg, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
KWD 113
Technology Thermal Paste 5.3W/mK 30ml, TG-S606C Silicone-Type Grease, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
KWD 12.500
Technology IG-A6250 High Performance Thermal Pad-60-80-0.5 - Thermal Conductivity 5.0 W/mK - for IC SSD CPU GPU Heat Sink LED Chipset Cooling
KWD 4
Technology IG-A6250 High Performance Thermal Pad-60-80-1.0 - Thermal Conductivity 5.0 W/mK - for IC SSD CPU GPU Heat Sink LED Chipset Cooling
KWD 6
Technology Thermal Paste 8.0 W/mK 55ml, TG-N8000 Non-Silicone Putty, Thermal Gel Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components
KWD 48.500
Technology Thermal Gel 6.3 W/mK 30ml, TG6060 Silicone-Type Putty, Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components
KWD 30
Technology Thermal Paste 4.0 W/mK 55ml, TG-N4000 N0n-Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU…
KWD 49
Technology Thermal Paste 4.0 W/mK 30ml, TG-N4000 N0n-Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU…
KWD 37.500
Technology Thermal Paste 9.0 W/mK 30g, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
KWD 4
Thermal Paste 5.3W/mK 1KG, TG-S606C Silicone-Type Grease, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
KWD 113
Technology Thermal Paste 3.2 W/mK 55ml, TG-4040 Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
KWD 44.500
Technology Thermal Paste 6.3 W/mK 55ml, TG-6060 Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
KWD 48
T-Globlal Technology Thermal Paste 7.0 W/mK 20ml, TG-A7000 Silicone-Type Putty, Thermal Gel Between Liquid and Solid State, Applied with Dispenser, Heat Sink Cooling, for Electronic Components
KWD 10.500
