Thermal Pad, 120x120x2.0mm, 12.8 W/m.K Thermal Compound Pad, Thermal Conductivity Gap Filler, Heatsink Cooling Pad All Coolers, CPU, GPU, IC Processor, 3D Printer, Raspberry Pi
KWD 11
Thermal Paste, 2g CPU Thermal Compound Paste, Heatsink Paste for All Coolers, CPU, GPU, IC Processor, Carbon Based High Performance, Thermal Interface Material
KWD 2.500